Development of an electrically conductive filament for the FFF process based on a low-melting-point metal
DOI:
https://doi.org/10.60673/zak.2024.64Keywords:
Additive manufacturing, fused filament fabrication, electrically conductive plastics, low-melting metal, morphology, viscosityAbstract
This article presents the development of an electrically conductive filament based on a low-melting-point metal (tin). As the tin content increases, the resistance decreases and a tin edge layer forms. The resistance is related to the filler content and the associated more pronounced network structure. Filaments with a specific electrical resistance of 2.81 E-5 Ω m were developed.
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Published
2024-07-16
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Voll, J., & Roth, S. (2024). Development of an electrically conductive filament for the FFF process based on a low-melting-point metal. Zeitschrift für Angewandte Kunststofftechnik. https://doi.org/10.60673/zak.2024.64
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Copyright (c) 2024 Joshua Voll
This work is licensed under a Creative Commons Attribution 4.0 International License.