Rheology of conductive tin powder compounds Part 2
DOI:
https://doi.org/10.60673/zak.2025.163Keywords:
Rheology, tin powder compounds, low-melting-point metals, amplitude sweep, frequency sweepAbstract
In this study, the rheological properties of PE-HD-tin compounds above the melting point of tin were investigated. The results show an increase in the storage modulus G' for all filler concentrations, which is caused by the high surface tension of the tin. In the high-frequency range, G' shows a percolation-dependent behavior, with a maximum at 24 vol%. In the low-frequency range, a direct influence of the filler volume on G' is recognizable.
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2025-12-09 — Updated on 2025-12-09
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- 2025-12-09 (2)
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How to Cite
Voll, J., & Roth, S. (2025). Rheology of conductive tin powder compounds Part 2. Zeitschrift für Angewandte Kunststofftechnik. https://doi.org/10.60673/zak.2025.163
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Copyright (c) 2025 Joshua Voll, Stefan Roth
This work is licensed under a Creative Commons Attribution 4.0 International License.
